Monolithic 3D integration inter-tier vias insertion scheme and associated layout structure

ABSTRACT

A 3D-IC includes a first tier device and a second tier device. The first tier device and the second tier device are vertically stacked together. The first tier device includes a first substrate and a first interconnect structure formed over the first substrate. The second tier device includes a second substrate, a doped region formed in the second substrate, a dummy gate formed over the substrate, and a second interconnect structure formed over the second substrate. The 3D-IC also includes an inter-tier via extends vertically through the second substrate. The inter-tier via has a first end and a second end opposite the first end. The first end of the inter-tier via is coupled to the first interconnect structure. The second end of the inter-tier via is coupled to one of: the doped region, the dummy gate, or the second interconnect structure.

PRIORITY DATA

The present application is a divisional of U.S. application Ser. No.15/630,685, filed Jun. 22, 2017, now U.S. Pat. No. 10,170,404, issuedJan. 1, 2019, entitled “MONOLITHIC 3D INTEGRATION INTER-TIER VIASINSERTION SCHEME AND ASSOCIATED LAYOUT STRUCTURE,” which is a divisionalof Ser. No. 14/840,364, filed Aug. 31, 2015, now U.S. Pat. No.9,691,695, issued Jun. 27, 2017, the entire disclosure of which isincorporated herein by reference.

BACKGROUND

The semiconductor integrated circuit (IC) industry has experienced rapidgrowth. Technological advances in IC materials and design have producedgenerations of ICs where each generation has smaller and more complexcircuits than the previous generation. However, these advances haveincreased the complexity of processing and manufacturing ICs and, forthese advances to be realized, similar developments in IC processing andmanufacturing are needed. In the course of integrated circuit evolution,functional density (i.e., the number of interconnected devices per chiparea) has generally increased while geometry size (i.e., the smallestcomponent (or line) that can be created using a fabrication process) hasdecreased.

The integration density of various electronic components (e.g.,transistors, diodes, resistors, capacitors, etc.) is improved bycontinual reductions in minimum feature size, which allow morecomponents to be integrated into a given area. These smaller electroniccomponents also require smaller packages that utilize less area thanpackages of the past in some applications. Thus, new packagingtechnologies, such as a three dimensional (3D) packaging, have beendeveloped. However, even for ICs with 3D packaging (referred to as3D-ICs), layout area has not been fully optimized, and routingflexibility—though better than 2D packaging ICs—still needs improvement.

Therefore, while conventional 3D-ICs have been generally adequate fortheir intended purposes, they have not been entirely satisfactory inevery aspect.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isemphasized that, in accordance with the standard practice in theindustry, various features are not drawn to scale. In fact, thedimensions of the various features may be arbitrarily increased orreduced for clarity of discussion.

FIGS. 1A-5A are diagrammatic fragmentary top views of a portion of a3D-IC in accordance with some embodiments of the present disclosure.

FIGS. 1B-5B are diagrammatic fragmentary cross-sectional side views of aportion of a 3D-IC in accordance with some embodiments of the presentdisclosure.

FIGS. 6A-6B and 7A-7C are diagrammatic fragmentary top viewsillustrating a decomposition of a circuit cell into separate portionslocated on different tiers of a 3D-IC in accordance with someembodiments of the present disclosure.

FIGS. 8A-8B are diagrammatic fragmentary cross-sectional side viewsillustrating a decomposition of a circuit cell into separate portionslocated on different tiers of a 3D-IC in accordance with someembodiments of the present disclosure.

FIGS. 9A-9B are diagrammatic fragmentary top view and cross-sectionalside view illustrating a PMOS and an NMOS implemented on different tiersof a 3D-IC in accordance with some embodiments of the presentdisclosure.

FIG. 10 is a flowchart illustrating a method of fabricating a 3D-ICdevice in accordance with some embodiments of the present disclosure.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the provided subjectmatter. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. For example, the formationof a first feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

As the scaling down process for semiconductor Integrated Circuits (ICs)continues, the shrinking device sizes have led to ICs with smaller diearea and higher device densities. In that regard, 3D-ICs have beendeveloped to effectively increase the number of semiconductor devices ona chip without enlarging the horizontal dimensions of the chip. In atypical 3D-IC, dies are either bonded on interposers, packagesubstrates, or stacked vertically on other dies. However, conventional3D-ICs may still suffer from shortcomings such as inefficient use ofsilicon area to facilitate electrical routing between a top die and abottom die vertically stacked together.

To overcome the problems associated with conventional 3D-ICs, thepresent disclosure uses inter-tier vias to electrically interconnectmicroelectronic components on a bottom tier die with microelectroniccomponents on a top tier die vertically stacked on the bottom tier die.The various usage scenarios involving the inter-tier vias according tothe present disclosure will now be discussed in more detail withreference to FIGS. 1A-5A, 5A-5B, 6A-6B, 7A-7C, 8A-8B, 9A-9B, and 10.

FIG. 1A is a diagrammatic fragmentary top view of a portion of a 3D-ICdevice 50, and FIG. 1B is a diagrammatic fragmentary cross-sectionalside view of a portion of a 3D-IC device 50. The portion of the 3D-ICdevice 50 shown in FIG. 1A generally represents the portion of the 3D-ICdevice 50 shown in FIG. 1B, but it is understood that they may not havean exact one-to-one correspondence for reasons of simplicity.

As is shown clearly in the cross-sectional side view of FIG. 1B, the3D-IC device 50 includes a bottom tier device 50A and a top tier device50B. The bottom tier device 50A includes a substrate 60. The substrate60 may contain various passive and active microelectronic devices (orportions thereof) such as resistors, capacitors, inductors, diodes,metal-oxide semiconductor field effect transistors (MOSFET),complementary metal-oxide semiconductor (CMOS) transistors, bipolarjunction transistors (BJT), laterally diffused MOS (LDMOS) transistors,high power MOS transistors, or other types of transistors. In someembodiments, the substrate 60 is a silicon substrate doped with a p-typedopant such as boron (for example a p-type substrate). In otherembodiments, the substrate 60 could be a silicon substrate that is dopedwith an n-type dopant such as phosphorous or arsenic (an n-typesubstrate).

As shown in FIG. 1B, a plurality of source/drains 70 may be formed inthe substrate 60. A plurality of gates 80 may also be formed over thesubstrate 60. In some embodiments, the gates 80 each include a siliconoxide gate dielectric component and a polysilicon gate electrodecomponent. In other embodiments, the gates 80 each include a high-k gatedielectric component and a metal gate electrode component. A high-kdielectric material is a material having a dielectric constant that isgreater than a dielectric constant of SiO₂, which is approximately 4. Invarious embodiments, the high-k gate dielectric component may containhafnium oxide HfO₂, ZrO₂, Y₂O₃, La₂O₅, Gd₂O₅, TiO₂, Ta₂O₅, HfErO, HfLaO,HfYO, HfGdO, HfAlO, HfZrO, HfTiO, HfTaO, or SrTiO. The metal gateelectrode component may include a work function metal (e.g., TiN, W, WN,W, or WAl) for tuning the work function of the gate, and a fill metal(e.g., Al, Ti, W, or Cu) for serving as the main electrically conductiveportion of the gate electrode component.

According to the various aspects of the present disclosure, at least oneof the gates 80A is a floating gate. The floating gate 80A iselectrically floating. For example, the floating gate 80A is notelectrically coupled to power supply rails VDD or VSS, and it is notconsidered part of a functional transistor. In the embodiment shown inFIG. 1B, the floating gate 80A is located at the edge of the invertercircuit of the bottom tier device 50A. The floating gate 80A is notconsidered a functional member of the inverter circuit. In that sense,the floating gate 80A may also be referred to as a dummy gate. Since thefloating gate 80A is located in regions of the bottom tier device 50Athat did not otherwise have any use—for example outside the invertercircuit—it does not waste or consumer extra layout space. In otherwords, the implementation of the floating gate 80A does notunnecessarily increase layout area of the bottom tier device 50A. Evenwithout the floating gate 80A, the layout area would have been the same,since the source/drains 70 of the inverter circuit would have to beseparated from adjacent circuits (not illustrated herein) anyway.

One or more suitable microelectronic circuits may be formed by thesource/drains 70 and the gates 80. For example, an inverter circuit(represented by the dashed/broken lines in FIG. 1B) is formed in theportion of the bottom tier device 50A shown in FIG. 1B. Othermicroelectronic circuits formed in the bottom tier device 50A are notspecifically illustrated herein for reasons of simplicity.

An interconnect structure 100 is formed over the substrate 60 of thebottom tier device 60. The interconnect structure 100 includes aplurality of metal layers that each contain a plurality of metal lines,for example metal lines 110 as shown in FIG. 1B. The interconnectstructure 100 also includes a plurality of vias, for example vias 120,for electrically interconnecting the metal lines 110 with themicroelectronic components on the substrate 60 (e.g., source/drains 70or gates 80). For reasons of simplicity and clarity, not all the metallines and the vias are specifically labeled with their correspondingreference numerals 110 and 120 in FIG. 1B.

After the formation of the bottom tier device 50A, the top tier device50B is then formed on the bottom tier device 50A. The top tier device50B includes a substrate 160. The substrate 160 may contain a similarmaterial as the substrate 60 in some embodiments or may contain adifferent material than the substrate 60 in other embodiments. In someembodiments, the substrate 160 is formed over the bottom tier device 50Aby a deposition process. The deposition process may be chemical vapordeposition (CVD), deposition of doped amorphous semiconductor followedby solid-phase epitaxial regrowth (SPER), epitaxial lateral overgrowth(ELO), epitaxy, or the like. In some embodiments, the substrate 160 maybe substantially thinner than the substrate 60.

A plurality of doped regions such as source/drains 170 are formed in thesubstrate 160, and a plurality of gates 180 are formed over thesubstrate 160. Similar to the gates 80, the gates 180 may include asilicon oxide gate dielectric component and a polysilicon gate electrodecomponent, or a high-k gate dielectric component and a metal gateelectrode component. The source/drains 170 and the gates 180 are alsoshown in the top view of FIG. 1A. Note that at least one of the gates180A is a floating gate. The floating gate 180A is electricallyfloating. For example, the floating gate 180A is not electricallycoupled to power supply rails VDD or VSS, and it is not considered partof a functional transistor.

Various microelectronic circuit components may be formed by thesource/drains 170 and the gates 180, for example a NAND circuit and aninverter circuit (represented by the dashed/broken lines in FIG. 1B). Itis understood that other microelectronic circuits formed in the top tierdevice 50B are not specifically illustrated herein for reasons ofsimplicity. As shown in FIGS. 1A and 1B, the floating gate 180A islocated in between two microelectronic circuit components, i.e., betweenthe NAND circuit and the inverter circuit. The floating gate 180A is notconsidered a functional member of either the NAND circuit or theinverter circuit. In that sense, the floating gate 180A may also bereferred to as a dummy gate. Since the floating gate 180A is located inregions of the top tier device 50B that did not otherwise have anyuse—for example between the NAND circuit and the inverter circuit—itdoes not waste or consumer extra layout space. In other words, theimplementation of the floating gate 180A does not unnecessarily increaselayout area of the top tier device 50B. Even without the floating gate180A, the layout area would have been the same, since the source/drains170 of the NAND circuit have to be separated from the source/drains 170of the inverter circuit anyway.

According to the various aspects of the present disclosure, one or moreinter-tier vias are formed to facilitate the electrical interconnectionsbetween various microelectronic components on the bottom tier device 50Aand the top tier device 50B. Generally, an inter-tier via is aconductive element that extends vertically through an entire substrate,for example the substrate 160 of the top tier device 50B. The inter-tiervia may contain a suitable metal material such as tungsten, aluminum,copper, or combinations thereof. The inter-tiers will be discussed inmore detail below.

After the formation of the inter-tier vias, an interconnect structure200 is formed over the substrate 160 of the top tier device 160. Theinterconnect structure 200 includes a plurality of metal layers thateach contain a plurality of metal lines, for example metal lines 210 asshown in FIG. 1B. The interconnect structure 200 also includes aplurality of vias, for example vias 220, for electricallyinterconnecting the metal lines 210 with the components on the substrate60 (e.g., source/drains 170 or gates 180). For reasons of simplicity andclarity, not all the metal lines and the vias are specifically labeledwith their corresponding reference numerals 210 and 220 in FIG. 1Bherein.

In FIG. 1B, an inter-tier via 250 is formed directly below the floatinggate 180A of the top tier device 50B and directly above one of the metallines 110 of the bottom tier device 50A. As such, the inter-tier via 250electrically couples the floating gate 180A and the metal line 110together. Since the floating gate 180A is also electrically coupled toone of the metal lines 210 (for example in a metal-1 layer of theinterconnect structure 200 on the top tier device 50B), and since themetal line 110 is also electrically coupled to one or moremicroelectronic components (e.g., source/drains 70) of the invertercircuit on the bottom tier device 50A, the inter-tier via 250 and thefloating gate 180A effectively allow the inverter circuit of the bottomtier device 50A to gain electrical access to the interconnect structure200 of the top tier device 50B.

As discussed above, the implementation of the floating gate 180A doesnot result in wasted layout area or space. As such, the use of thefloating gate 180A (and the corresponding inter-tier via 250 below) toprovide electrical interconnections between the metal layers of the toptier device 50B and the microelectronic components of the bottom tierdevice 50A does not result in increased layout area or space either. Inthis manner, the present disclosure provides an efficient layout andinterconnection scheme using floating gates (or dummy gates) andinter-tier vias.

As another example, an inter-tier via 260 is implemented directly belowone of the source/drains 170 in the inverter circuit of the top tierdevice 50B and directly above one of the metal lines 110 of the bottomtier device 50A. As such, the inter-tier via 260 electrically couplesthe inverter of the top tier device 50B and the metal line 110 of thebottom tier device 50B together. As shown in FIG. 1B, the metal line 110located below the inter-tier via 260 is also electrically coupled to thefloating gate 80A (through another one of the vias 120). The floatinggate 80A is also electrically coupled to the rest of the interconnectstructure 100 through another one of the vias 120. Thus, the inter-tiervia 260 and the floating gate 80A collectively allow the invertercircuit of the top tier device 50B to gain electrical access to theinterconnect structure 100 of the bottom tier device 50A, where thefloating gate 80A serves as a conduction layer or conduction elementherein.

FIGS. 2A-2B provide another example embodiment of the present disclosureinvolving inter-tier vias. Similar to FIGS. 1A-1B, FIG. 2A is adiagrammatic fragmentary top view of a portion of a 3D-IC device 50, andFIG. 2B is a diagrammatic fragmentary cross-sectional side view of aportion of the 3D-IC device 50. The portion of the 3D-IC device 50 shownin FIG. 2A generally represent the portion of the 3D-IC device 50 shownin FIG. 2B, but it is understood that they may not have an exactone-to-one correspondence for reasons of simplicity. In addition, forreasons of consistency and clarity, similar components in FIGS. 1A-1Bare labeled the same in FIGS. 2A-2B.

As shown in FIG. 2B, the top tier device 50B is formed over the bottomtier device 50A. The bottom tier device 50A includes a substrate 60, andthe top tier device 50B includes a substrate 160. Source/drains 70 areformed in the substrate 60, and source/drains 170 are formed in thesubstrate 160. Gates 80 are formed on the substrate 60, and gates 180are formed on the substrate 160.

On the top tier device 50B, floating gates 180A and 180B are formedbetween neighboring circuit devices, for example between two invertercircuits (the inverter circuit on the left is only partially illustratedfor reasons of simplicity). As discussed above with reference to FIGS.1A-1B, the floating gates 180A-180B are not connected to VDD or VSS, orare they considered parts of the inverter circuit. In that sense, thefloating gates 180A-180B are considered dummy gates. In many situations,one such dummy gate placed between neighboring circuits would besufficient. However, in some situations, metal line end-to-endviolations may become an issue. For example, a via connected to afloating gate may be too close to metal lines over a neighboring circuitdevice. This may lead to electrical shorting, and therefore extraspacing may be needed between the via and the neighboring metal lines.In the embodiment shown in FIGS. 2A-2B, the floating gate 180B is addedas an extra dummy gate to create such extra spacing. As such, the via220 connected to the floating gate 180A is sufficiently far away fromthe metal line 210 disposed above the neighboring inverter (to theright).

An inter-tier via 270 is implemented to electrically connect thefloating gate 180A from the top tier device 50B and the metal line 110from the bottom tier device 50A. Similar to the inter-tier via 250 and260 discussed above with reference to FIGS. 1A-1B, the inter-tier via270 herein provides electrical access of the interconnect structure 200of the top tier device 50B to the microelectronic components of thebottom tier device 50A, without wasting extra layout area. In otherwords, through the inter-tier via 270 and the dummy gate 180A,components from the NAND circuit of the bottom tier device 50A mayeffectively utilize the routing sources of the interconnect structure200 of the top tier device 50B.

It is understood that in some embodiments, either one of the floatinggates 180A and 180B, or both, may be used to connect to inter-tier vias.For example, referring to FIGS. 3A-3B, which illustrate an embodiment ofthe 3D-IC 50 similar to the embodiment shown in FIGS. 2A-2B, a secondinter-tier via 271 is implemented between the metal line 110 and thefloating gate 180B. In this case, the inter-tier via 271 and thefloating gate 180B duplicate the functionalities of the inter-tier via270 and the floating gate 180A, because both inter-tier vias 270 and 271are electrically connected to the same metal line 110, and because bothfloating gates 180A and 180B are electrically coupled (through theirrespective vias) to the same metal line 210. However, in otherembodiments, the floating gates 180A and 180B may be electricallycoupled to different components (e.g., different metal lines) from thetop tier device 50B, and/or the inter-tier vias 270/271 may beelectrically coupled to different components (e.g., different metallines) from the bottom tier device 50A. In these embodiments, theinter-tier via 271 and the floating gate 180B would not merely beduplicating the functionalities of the inter-tier via 270 and thefloating gate 180A. Instead, the inter-tier via 271 and the floatinggate 180B would be offering different electrical interconnectionpossibilities for the appropriate components from the bottom tier device50A and the top tier device 50B.

FIGS. 4A-4B provide yet another example embodiment of the presentdisclosure involving inter-tier vias. Similar to FIGS. 1A-1B, FIG. 4A isa diagrammatic fragmentary top view of a portion of a 3D-IC device 50,and FIG. 4B is a diagrammatic fragmentary cross-sectional side view of aportion of the 3D-IC device 50. The portion of the 3D-IC device 50 shownin FIG. 4A generally represent the portion of the 3D-IC device 50 shownin FIG. 4B, but it is understood that they may not have an exactone-to-one correspondence for reasons of simplicity. In addition, forreasons of consistency and clarity, similar components in FIGS. 1A-1Bare labeled the same in FIGS. 4A-4B.

As shown in FIG. 4B, the top tier device 50B is formed over the bottomtier device 50A. The bottom tier device 50A includes a substrate 60, andthe top tier device 50B includes a substrate 160. Source/drains 70 areformed in the substrate 60, and source/drains 170 are formed in thesubstrate 160. Gates 80 are formed on the substrate 60, and gates 180are formed on the substrate 160.

On the top tier device 50B, a floating gate 180A is formed at the edgeof the inverter circuit. In addition, the top tier device 50B includesan empty cell 300. Generally, empty cells (like the empty cell 300herein) do not contain functional transistors or doped regions. They aretypically implemented in areas of the IC where routing is congested, sothat these empty cells can provide a clean space for electrical routing.In the embodiment shown in FIG. 4A, the empty cell 300 contains floatinggates 180B, 180C, and 180D, which for reasons of simplicity are notillustrated in the cross-sectional view of FIG. 4B (and neither is thefloating gate 180A).

An inter-tier via 310 is implemented in the empty cell 300. Theinter-tier via 310 electrically connects one of the metal lines 210 fromthe top tier device 50B to one of the metal line 110, and in turn to theNAND circuit from the bottom tier device 50A. Similar to the inter-tiervia 250 and 260 discussed above with reference to FIGS. 1A-1B, theinter-tier via 310 herein provides electrical access of the interconnectstructure 200 of the top tier device 50B to the microelectroniccomponents of the bottom tier device 50A, without wasting extra layoutarea (since the empty cell 300 would have been implemented anyway toreduce routing congestion).

Although not specifically illustrated, it is also understood that theinter-tier via 310 (or additional inter-tier vias) may be connected toany one of the floating gates 180B-180D of the empty cell 300. Inaddition, through the implementation of the inter-tier via 310, any oneof the floating gates 180B-180D may be used as a conduction layer forthe metal lines 110 of the bottom tier device 50A.

FIGS. 5A and 5B provide further example embodiments of the presentdisclosure involving inter-tier vias. FIG. 5A is a diagrammaticfragmentary top view of a portion of a 3D-IC device 50, and FIG. 5B is adiagrammatic fragmentary cross-sectional side view of a portion of the3D-IC device 50. The portion of the 3D-IC device 50 shown in FIG. 5Adoes not necessarily correspond to the portion of the 3D-IC device 50shown in FIG. 5B. In other words, FIGS. 5A and 5B may each correspond toa different embodiment of the present disclosure. For reasons ofconsistency and clarity, however, components such as substrate,source/drains, gates, etc. that appear in the previous FIGS. 1A-1B to4A-4B are labeled the same in FIGS. 5A-5B.

According to the embodiment shown in FIG. 5A, a floating gate 180A maybe electrically connected to an inter-tier via 320. The inter-tier via320 is also electrically connected to a metal line 330, which runs alongthe length of the elongated floating gate 180A. In other words, whereasthe rest of the metal line 210 in FIG. 5A run along a first axis (e.g.,horizontally in FIG. 5A), the metal line 330 connected to the inter-tiervia 320 run along a second axis (e.g., vertically in FIG. 5A)perpendicular to the first axis. This type of 2-dimensional metal schemecan resolve metal-0 minimum area issues or line-to-line spacing issues.

Referring now to the embodiment shown in FIG. 5B, two example inter-tiervias 350A and 350B are implemented. The inter-tier via 350A iselectrically connected to a metal line 210A of the top tier device 50Band a metal line 110 of the bottom tier device 50A. The inter-tier via350B is electrically connected to a metal line 210B of the top tierdevice 50B and the metal line 110 of the bottom tier device 50A. In thismanner, the metal lines 210A and 210B of the top tier device 50B areelectrically connected together. The inter-tier vias 350A and 350B serveas electrically conductive bridges herein. The configuration describedabove with reference to FIG. 5B is helpful when the routing has becomecongested for the top tier device 50B. By using the inter-tier vias 350Aand 350B as bridges to the metal lines in the bottom tier device 50A,the top tier device 50B effectively gain access to the routing resourcesof the bottom tier device 50A. For example, if the top tier device 50Band the bottom tier device 50A each have 8 metal layers, then with theconfiguration shown in FIG. 5B, the top tier can effectively utilize 16metal layers (i.e., the sum of 8+8) for routing.

The approach discussed above with reference to FIG. 5B may also be usedto allow the bottom tier device 50A to take advantage of the routingresources of the top tier device 50B as well. For example, theinter-tier vias 350A and 350B may be connected to the same metal line inthe top tier device 50B but may be connected to different metal lines inthe bottom tier device 50A, in which case the metal lines of the bottomtier device are electrically coupled together using the inter-tier vias350A/350B as bridges. For reasons of simplicity, this embodiment is notspecifically illustrated herein.

FIGS. 6A and 6B provide yet another example embodiment of the presentdisclosure involving the use of inter-tier vias to break down largecells. In more detail, FIG. 6A is a diagrammatic fragmentary top view ofa “large cell” 400. A large cell may refer to a cell or a circuit thatconsumes relatively a large amount of IC area and/or includes manytransistors. For example, the large cell 400 shown in FIG. 6A contains aplurality of gates 410 (only some of which are labeled). The large cell400 also includes rails VD (an example power rail) and GND (groundrail). Since the large cell 400 consumes more chip area, it needs moreElectromigration margin and is more sensitive to power/ground IR drop.Enlarging the VD/GND rail width would increase cell height and degradegate density.

To overcome these problems, the large cell 400 is split into twoseparate segments 400A and 400B according to the various aspects of thepresent disclosure. FIG. 6B is a diagrammatic fragmentary top view ofthe “large cell” being broken down to two separate pieces 400A and 400B.The piece 400A corresponds to a “left” portion of the large cell 400,and the piece 400B corresponds to a “right” portion of the large cell400. The pieces 400A and 400B are split by approximately “cutting” thelarge cell across its middle, represented by the dashed lines in FIG.6A. The piece 400A is implemented on a top tier device of a 3D-IC, whilethe piece 400B is “folded” 180 degrees and then implemented on a bottomtier of the 3D-IC, where the top tier device is formed over the bottomtier device vertically. The pieces 400A and 400B implemented on top andbottom tiers of the 3D-IC device are electrically interconnectedtogether by inter-tier vias similar to those discussed above withreference to FIGS. 1A-1B to FIGS. 5A-5B.

By splitting the large cell 400 into two separate pieces that areimplemented on top and bottom tiers of a 3D-IC, the Electromigrationmargin can be relaxed. It also reduces the power/ground rail averagecurrent and gains two times the total power/ground width. This isbecause the top tier (on which the piece 400A is implemented) has itsown power/ground rails VD and GND, and the bottom tier (on which thepiece 400B is implemented) also has its own power/ground rails VD andGND. In other words, power and ground rails are both doubled. This isalso done without increasing density or affecting chip layout, since thesame large cell 400 is effectively reconstructed in a three-dimensionalmanner by stacking the pieces 400A and 400B vertically on the 3D-IC.

FIGS. 7A-7C are diagrammatic fragmentary top views of the “large cell”400 being split or decomposed according to different embodiments of thepresent disclosure. As shown in FIG. 7A, the large cell 400 (containing20 gates) is split substantially evenly along its middle (represented bythe dashed “cutline” 410 in FIG. 7B, which also appears in FIGS. 7B-7C),and thus the left portion 400A and the right portion 400B eachcorrespond to about 50% of the area of the total cell 400. This may bereferred to as a decomposition process. It is understood that thedecomposition process illustrated herein splits the large cell 400substantially evenly across its middle, the cell may be split in otherways in alternative embodiments, for example a 40%/60% split, or a55%/45% split. In some embodiments, the decomposition may be performedsuch that the “cutline” 410 is positioned at areas of the cell that isoutside of circuits or microelectronic components that have importantfunctionalities, so as to minimize any potential risks associated withthe decomposition.

After being decomposed, the inter-tier vias need to be placed near theedges of the decomposed portions 400A and 400B, which may firstinvolving “stretching” the cell 400 to make room for the inter-tiervias. In the embodiment shown in FIG. 7B, the large cell 400 isartificially “stretched” horizontally by one pitch. Since the large cell400 contains 20 gates in this example, stretching the cell 400 by onepitch enlarges the total area of the cell by about 5%, which is notsubstantial.

Still referring to FIG. 7B, inter-tier vias 420A, 421A, and 422A areplaced on the right edge of the decomposed portion 400A, and inter-tiervias 420B, 421B, and 422B are placed on the left edge of the decomposedportion 400B. The inter-tier vias 420A and 420B are disposedsubstantially symmetrically on either side of the “cutline” 410, theinter-tier vias 421A and 421B are disposed substantially symmetricallyon either side of the “cutline” 410, and inter-tier vias 422A and 422Bare disposed substantially symmetrically on either side of the “cutline”410. This is so that when the decomposed cell portions 400A and 400B areimplemented on the different tiers of the 3D-IC, the inter-tier via 420Awill vertically align with the inter-tier via 420B, the inter-tier via421A will vertically align with the inter-tier via 421B, and theinter-tier via 422A will vertically align with the inter-tier via 422B.In other words, when the cell 400 “folded” around the “cutline” 410, theinter-tier vias 420B-422B will be vertically aligned with the inter-tiervias 420A-422A. The inter-tier via 420B-422B are aligned with theinter-tier vias 420A-422A so as to establish electrical interconnectionsbetween the decomposed cell portions 400A and 400B. Thus, it isunderstood that the inter-tier vias 420A and 420B are actually the sameinter-tier via, the inter-tier vias 421A and 410B are actually the sameinter-tier via, and the inter-tier vias 422A and 422B are actually thesame inter-tier via, even though they are being illustrated separatelyon the top views herein.

In the embodiment shown in FIG. 7C, the large cell 400 is artificially“stretched” horizontally by two pitches. Since the large cell 400contains 20 gates in this example, stretching the cell 400 by twopitches enlarges the total area of the cell by about 10%, which is stillnot substantial. The reason that the embodiment shown in FIG. 7Cstretches the cell 400 by two pitches is to avoid potential layout ruleviolations due to close proximity of inter-tier vias, as discussedbelow.

Still referring to FIG. 7C, inter-tier vias 420A, 421A, and 422A areplaced on the right edge of the decomposed portion 400A, and inter-tiervias 420B, 421B, and 422B are placed on the left edge of the decomposedportion 400B. The inter-tier vias 420A and 420B are disposedsubstantially symmetrically on either side of the “cutline” 410, theinter-tier vias 421A and 421B are disposed substantially symmetricallyon either side of the “cutline” 410, and inter-tier vias 422A and 422Bare disposed substantially symmetrically on either side of the “cutline”410. Again, this is done so that when the decomposed cell portions 400Aand 400B are implemented on the different tiers of the 3D-IC, theinter-tier via 420A will vertically align with the inter-tier via 420B,the inter-tier via 421A will vertically align with the inter-tier via421B, and the inter-tier via 422A will vertically align with theinter-tier via 422B, so as to establish electrical interconnectionsbetween the decomposed cell portions 400A and 400B. Again, it isunderstood that the inter-tier vias 420A and 420B are actually the sameinter-tier via, the inter-tier vias 421A and 421B are actually the sameinter-tier via, and the inter-tier vias 422A and 422B are actually thesame inter-tier via, even though they are being illustrated separatelyon the top views herein.

Unlike the embodiment shown in FIG. 7B, the inter-tier vias 421A and421B in the embodiment shown in FIG. 7C are horizontally offset from theinter-tier vias 420A/422A and 420B/422B, respectively. In other words,the inter-tier vias 420A-422A have a staggered formation, as do theinter-tier vias 420B-422B. The horizontal offset between the inter-tiervias 420A-422A (and between the inter-tier vias 420B-422B) allows theinter-tier via 421A to be spaced farther apart from the inter-tier vias420A/422A, and allows the inter-tier via 421B to be spaced farther apartfrom the inter-tier vias 420B/422B. The increased spacing between theinter-tier vias avoids potential layout rule violations. In other words,the additional layout area increase (from 5% to 10%), while a penalty,is done to ensure there are no layout rule violations. This may be aworthwhile tradeoff in many situations.

Referring now to FIGS. 8A and 8B, FIG. 8A is a diagrammatic fragmentarycross-sectional side view of the large cell 400 discussed above withreference to FIG. 6A or 7A, and FIG. 8B is diagrammatic fragmentarycross-sectional side view of the decomposed portions 400A and 400B ofthe cell 400. The decomposed portion 400A of the cell is implemented ona top tier device 50B of a 3D-IC, and the decomposed portion 400B of thecell is implemented on a bottom tier device 50A of a 3D-IC. The arrowsshown in FIGS. 8A and 8B help illustrate the directionality of the“flipping” (as a part of the decomposition of the cell 400) process. Inother words, the arrows herein indicate how the cell portions 400A and400B are oriented before and after the flipping.

As illustrated in FIG. 8B, inter-tier vias 420 and 421 are implementedto electrically interconnect the cell portions 400A and 400B. Asdiscussed above, the inter-tier via 420 is illustrated as inter-tiervias 420A and 420B in FIGS. 7B-7C, and the inter-tier via 421 isillustrated as inter-tier vias 421A and 421B in FIGS. 7B-7C. Theinter-tier vias 420A and 420B are vertically aligned because they arereally the same inter-tier via 420, and the inter-tier vias 421A and421B are vertically aligned because they are really the same inter-tiervia 421. The inter-tier via 422 is not illustrated herein for reasons ofsimplicity.

As shown in FIG. 8B, the top end of the inter-tier via 420 is directlyconnected to one of the metal lines 210A of the top tier device 50B, andthe bottom end of the inter-tier via 420 is directly connected to one ofthe metal lines 110A of the bottom tier device 50A. The top end of theinter-tier via 421 is directly connected to one of the metal lines 210Bof the top tier device 50B, and the bottom end of the inter-tier via 420is directly connected to one of the metal lines 110B of the bottom tierdevice 50A. Through these connections, the decomposed cell portions 400Aand 400B are still electrically interconnected together in the samemanner as the cell 400 is in FIG. 8A. Therefore, the decomposition ofthe cell 400 does not interfere with the functionality of the cell 400,while offering benefits such as relaxed Electromigration margin andreduced power/ground rail average current, etc.

FIGS. 9A-9B illustrate yet another example embodiment of the presentdisclosure involving inter-tier vias. Similar to FIGS. 1A-1B, FIG. 9A isa diagrammatic fragmentary top view of a portion of a 3D-IC device 50,and FIG. 9B is a diagrammatic fragmentary cross-sectional side view of aportion of the 3D-IC device 50. The portion of the 3D-IC device 50 shownin FIG. 9A generally represent the portion of the 3D-IC device 50 shownin FIG. 9B, but it is understood that they may not have an exactone-to-one correspondence for reasons of simplicity.

In more detail, the portion of the 3D-IC device 50 includes a circuitcell that includes a p-type transistor, which is a PMOS in thisembodiment, and an n-channel transistor, which is an NMOS in this case.The PMOS is implemented on the top tier device 50B, while the NMOS isimplemented on the bottom tier device 50A, or vice versa. Theapproximate outlines of the PMOS and the NMOS are illustrated as brokenlines in FIGS. 9A and 9B. Also, the top view of the NMOS and PMOS areboth illustrated in FIG. 9A for additional clarity, even though the NMOSwould not be directly visible since it would be blocked by the PMOS.

Doped regions such as source/drains 70 are formed in a substrate 60 ofthe bottom tier device 50A, and doped regions such as source/drains 170are formed in a substrate 160 of the top tier device 50B. Duringoperation, some of these source/drains are tied to Vdd, Vss, or out,etc., and they are labeled as such in FIGS. 9A-9B. Gates 80 and 180 arealso formed over the substrates 60 and 160, respectively. Duringoperation, some of these gates are being used as inputs, and they arelabeled as in1 and in2 in FIGS. 9A-9B.

At least one of the gates 80 is a dummy gate 80A, and at least one ofthe gates 180 is a dummy gate 180A, for example similar to the floatinggate 180A discussed above with reference to FIGS. 1-5. Metal lines suchas metal line 110 are formed as a part of an interconnect structure overthe substrate 60 in the bottom tier device 50A, and metal lines such asmetal line 210 are formed as a part of an interconnect structure overthe substrate 160 in the bottom tier device 50B.

Inter-tier vias 500, 510, and 520 are implemented to electricallyinterconnect the PMOS from the top tier device 50B to the NMOS from thebottom tier device 50A. In more detail, a top end of the inter-tier via500 is directly connected to the dummy gate 180A, and a bottom end ofthe inter-tier via 500 is directly connected to the dummy gate 80A. Atop end of the inter-tier via 510 is directly connected to the gate 180(in1) of the PMOS, and a bottom end of the inter-tier via 510 isdirectly connected to the gate 80 (in1) of the NMOS. A top end of theinter-tier via 520 is directly connected to the gate 180 (in2) of thePMOS, and a bottom end of the inter-tier via 510 is directly connectedto the gate 80 (in2) of the NMOS. It is understood that although theembodiment in FIGS. 9A-9B show the PMOS being stacked on the NMOS, thereverse may be true in alternative embodiments, meaning that an NMOS maybe stacked on the PMOS in those embodiments.

By stacking the PMOS and the NMOS of a circuit cell vertically on thetop and bottom tier devices of the 3D-IC, an area reduction of almost50% can be achieved compared to conventional 2D layout schemes of thecircuit cell with the PMOS and NMOS. Using dummy gates and inter-tiervias to electrically interconnect the PMOS and NMOS also offerselectrical routing simplicity and efficiency.

FIG. 9 is a flowchart of a method 900 of fabricating a 3D-IC deviceaccording to various aspects of the present disclosure. The method 900includes a step 910 of forming microelectronic components in a bottomsubstrate.

The method 900 includes a step 920 of forming a bottom interconnectstructure over the bottom substrate. The bottom interconnect structureincludes a plurality of bottom metal layers that each contain aplurality of bottom metal lines. The bottom substrate and the bottominterconnect structure collectively form a bottom tier device of the3D-IC.

The method 900 includes a step 930 of forming a top substrate over thebottom tier device.

The method 900 includes a step 940 of forming microelectronic componentsin the top substrate.

The method 900 includes a step 950 of forming an inter-tier via thatextends vertically through the top substrate.

The method 900 includes a step 960 of forming at least one dummy gateover the top substrate.

The method 900 includes a step 970 of forming a top interconnectstructure over the top substrate. The top interconnect structureincludes a plurality of top metal layers that each contain a pluralityof top metal lines. The top substrate and the top interconnect structurecollectively form a top tier device of the 3D-IC.

The inter-tier via is formed to electrically couple together the bottomtier device and at least one of: the microelectronic components formedin the top substrate, the at least one dummy gate, or the topinterconnect structure.

In some embodiments, the forming of the microelectronic components inthe top substrate comprises forming a plurality of circuit cells, andthe forming of the at least one dummy gate is performed such that the atleast one dummy gate is formed between two neighboring circuit cells.The dummy gate is not a functional part of any of the circuit cells.

In some embodiments, the forming of the microelectronic components inthe bottom substrate comprises forming microelectronic components of afirst type of transistor in the bottom substrate, and the forming of themicroelectronic components in the top substrate comprises formingmicroelectronic components of a second type of transistor in the bottomsubstrate. The first and second types of transistors are opposite types.The inter-tier via is formed so as to electrically couple together thefirst type of transistor and the second type of transistor.

In some embodiments, the method 900 further comprises a step ofdecomposing a circuit cell into a first segment and a second segment.The first segment of the decomposed circuit cell is implemented in thebottom tier device. The second segment of the decomposed circuit cell isimplemented in the top tier device. The first segment and the secondsegment are electrically interconnected together at least in part usingthe inter-tier via.

It is understood that additional processes may be performed before,during, or after the steps 910-970 of the method 900 to complete thefabrication of the 3D-IC device. For reasons of simplicity, theseadditional fabrication steps are not discussed herein in detail.

Based on the above discussions, it can be seen that the presentdisclosure offers advantages over conventional methods and devices oflow-k dielectric material fabrication. It is understood, however, thatother embodiments may offer additional advantages, and not alladvantages are necessarily disclosed herein, and that no particularadvantage is required for all embodiments. One advantage is that themonolithic 3D integration with two stacked devices can achievesubstantial area reduction. By using the inter-tier vias and dummy gatesto connect the top and bottom tier devices, no additional layout area iswasted. Inter-tier vias also allows for better utilization of routingresources. For example, by using one or more inter-tier vias, therouting resources (e.g., the metal layers) of a top tier device may beprovided to a bottom tier device, or vice versa. In other cases,inter-tier vias and dummy gates can also be used effectively asconduction layers or bridges for enhanced routing flexibility. Anotheradvantage is that large circuit cells may be decomposed into separatecell portions, which may then be implemented on the top and bottom tiersof a 3D-IC. This scheme offers improved Electromigration margin andreduced sensitivity to power/ground IR drop. Yet another advantage isthat the p-type and n-type transistors of a circuit can be implementedon the top and bottom tier devices of a 3D-IC, respectively. Thisapproach also offers layout area reduction and routing simplicity.

One aspect of the present disclosure pertains to a three-dimensionalIntegrated Circuit (3D-IC). The 3D-IC includes a first tier device thatincludes: a first substrate and a first interconnect structure formedover the first substrate. The 3D-IC also includes a second tier devicecoupled to the first tier device. The second tier device includes: asecond substrate, a doped region formed in the second substrate, a dummygate formed over the substrate, and a second interconnect structureformed over the second substrate. The 3D-IC includes an inter-tier viaextending vertically through the second substrate. The inter-tier viahas a first end and a second end opposite the first end. The first endof the inter-tier via is coupled to the first interconnect structure.The second end of the inter-tier via is coupled to one of: the dopedregion, the dummy gate, or the second interconnect structure.

Another aspect of the present disclosure pertains to a three-dimensionalIntegrated Circuit (3D-IC). The 3D-IC includes a bottom tier device thatincludes: a bottom substrate and a bottom interconnect structure locatedover the bottom substrate. The bottom interconnect structure includes aplurality of metal layers that each contain a plurality of metal lines.The 3D-IC includes a top tier device that includes: a top substrate, aplurality of circuit cells formed on the top substrate, a dummy gatethat is not a functional part of any of the circuit cells located at anedge of one of the circuit cells, and a top interconnect structurelocated over the top substrate. The top interconnect structure includesa plurality of metal layers that each contain a plurality of metallines. The top tier device is formed over the bottom tier device. The3D-IC includes an inter-tier via extending vertically through the topsubstrate. The inter-tier via has a top end and a bottom end oppositethe top end. The bottom end of the inter-tier via is directly connectedto one of the metal lines of the bottom interconnect structure. The topend of the inter-tier via is directly connected to the dummy gate or oneof the metal lines of the top interconnect structure.

Yet another aspect of the present disclosure pertains to a method offabricating a three-dimensional Integrated Circuit (3D-IC).Microelectronic components are formed in a bottom substrate. A bottominterconnect structure is formed over the bottom substrate. The bottominterconnect structure includes a plurality of bottom metal layers thateach contain a plurality of bottom metal lines. The bottom substrate andthe bottom interconnect structure collectively form a bottom tier deviceof the 3D-IC. A top substrate is formed over the bottom tier device.Microelectronic components are formed in the top substrate. Aninter-tier via is formed to extend vertically through the top substrate.At least one dummy gate is formed over the top substrate. A topinterconnect structure is formed over the top substrate. The topinterconnect structure includes a plurality of top metal layers thateach contain a plurality of top metal lines. The top substrate and thetop interconnect structure collectively form a top tier device of the3D-IC. The inter-tier via is formed to electrically couple together thebottom tier device and at least one of: the microelectronic componentsformed in the top substrate, the at least one dummy gate, or the topinterconnect structure.

The foregoing has outlined features of several embodiments so that thoseskilled in the art may better understand the detailed description thatfollows. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A method, comprising: forming a firstinterconnect structure over a first substrate, wherein the firstinterconnect structure includes a plurality of first interconnectelements; depositing a second substrate over the first substrate suchthat the first interconnect structure is disposed between the firstsubstrate and the second substrate; forming a first circuit cell and asecond circuit cell in the second substrate, wherein the first circuitcell and the second circuit cell are separated by an empty cell; andforming a via that extends through the empty cell but does not extendinto the first circuit cell or the second circuit cell, wherein the viais formed to be electrically coupled to the first interconnectstructure.
 2. The method of claim 1, further comprising: forming anelectrically-floating gate over the empty cell.
 3. The method of claim2, wherein the electrically-floating gate is not electrically coupled toa power rail and does not serve as a functional part of a transistor. 4.The method of claim 2, wherein the forming the electric ally-floatinggate comprises forming a plurality of electrically-floating gates overthe empty cell.
 5. The method of claim 4, wherein the forming of the viaand the forming of the electrically-floating gate are performed suchthat the via is connected with at least one of the electrically-floatinggates.
 6. The method of claim 2, wherein the forming theelectrically-floating gate comprises forming a firstelectrically-floating gate directly over the empty cell and forming asecond electrically-floating gate directly over an edge of the firstcircuit cell.
 7. The method of claim 1, wherein the empty cell is freeof containing doped regions or functional transistors therein.
 8. Themethod of claim 1, further comprising: forming a second interconnectstructure over the second substrate, wherein the second interconnectstructure includes a plurality of second interconnect elements, whereina first end of the via is in direct physical contact with one of thefirst interconnect elements, and wherein a second end of the via is indirect physical contact with one of the second interconnect elements. 9.The method of claim 8, wherein the forming the via is performed suchthat: the via is elongated in a first direction in a top view; and thefirst interconnect element or the second interconnect element that is indirect physical contact with the via is elongated in a second directionin the top view, wherein the first direction is different from thesecond direction.
 10. The method of claim 8, wherein: the forming of thevia comprises forming a first via and a second via; and the first via iselectrically coupled to the second via through the one of the firstinterconnect elements or the one of the second interconnect elements.11. A method, comprising: forming a first interconnect structure over afirst substrate, wherein the first interconnect structure includes aplurality of first interconnect elements; depositing a second substrateover the first substrate such that the first interconnect structure isdisposed between the first substrate and the second substrate; forming afirst circuit cell and a second circuit cell in the second substrate,wherein the first circuit cell and the second circuit cell are separatedby an empty cell that is free of containing doped regions or functionaltransistors therein; forming a via that extends through the empty cellbut does not extend into the first circuit cell or the second circuitcell, wherein the via is formed to be electrically coupled to the firstinterconnect structure; and forming a second interconnect structure overthe second substrate, wherein the second interconnect structure includesa plurality of second interconnect elements, and wherein at least one ofthe second interconnect elements is formed to be in direct physicalcontact with a second end of the via.
 12. The method of claim 11,further comprising: forming one or more electrically-floating gates overthe empty cell.
 13. The method of claim 12, wherein the one or moreelectrically-floating gates is not electrically coupled to any powerrails and does not serve as a functional part of a transistor.
 14. Themethod of claim 13, wherein the forming of the via and the forming ofthe one or more electrically-floating gates are performed such that thevia is connected with at least one of the electrically-floating gates.15. The method of claim 12, wherein the forming the one or moreelectrically-floating gates comprises forming a firstelectrically-floating gate directly over the empty cell and forming asecond electrically-floating gate directly over an edge of the firstcircuit cell.
 16. The method of claim 11, wherein the forming the via isperformed such that: the via is elongated in a first direction in a topview; and the first interconnect element or the second interconnectelement that is in direct physical contact with the via is elongated ina second direction in the top view, wherein the first direction isdifferent from the second direction.
 17. The method of claim 11,wherein: the forming of the via comprises forming a first via and asecond via; and the first via is electrically coupled to the second viathrough the one of the first interconnect elements or the one of thesecond interconnect elements.
 18. A method, comprising: forming a firstinterconnect structure over a first substrate, wherein the firstinterconnect structure includes a plurality of first interconnectelements; depositing a second substrate over the first substrate suchthat the first interconnect structure is disposed between the firstsubstrate and the second substrate; forming a first circuit cell and asecond circuit cell in the second substrate, wherein the first circuitcell and the second circuit cell are separated by an empty cell; forminga via that extends through the empty cell but does not extend into thefirst circuit cell or the second circuit cell, wherein the via is formedto be electrically coupled to the first interconnect structure; forminga second interconnect structure over the second substrate, wherein thesecond interconnect structure includes a plurality of secondinterconnect elements, wherein a first end of the via is in directphysical contact with one of the first interconnect elements, andwherein a second end of the via is in direct physical contact with oneof the second interconnect elements; wherein the forming the via isperformed such that: the via is elongated in a first direction in a topview; and the first interconnect element or the second interconnectelement that is in direct physical contact with the via is elongated ina second direction in the top view, wherein the first direction isdifferent from the second direction.
 19. The method of claim 18,wherein: the forming of the via comprises forming a first via and asecond via; and the first via is electrically coupled to the second viathrough the one of the first interconnect elements or the one of thesecond interconnect elements.
 20. The method of claim 18, furthercomprising: forming a first electrically-floating gate directly over theempty cell; and forming a second electrically-floating gate directlyover an edge of the first circuit cell.